74LVCZ16244ADGVRE4 vs 74LVCH32244AEC feature comparison

74LVCZ16244ADGVRE4 Texas Instruments

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74LVCH32244AEC NXP Semiconductors

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC BGA
Package Description TSSOP, TSSOP48,.25,16 LFBGA, BGA96,6X16,32
Pin Count 48 96
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW ENABLE LOW
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G48 R-PBGA-B96
JESD-609 Code e4 e0
Length 9.7 mm 13.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 4
Number of Bits 4 4
Number of Functions 4 8
Number of Ports 2 2
Number of Terminals 48 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LFBGA
Package Equivalence Code TSSOP48,.25,16 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 4.1 ns 4.5 ns
Propagation Delay (tpd) 4.4 ns 4.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn63Pb37)
Terminal Form GULL WING BALL
Terminal Pitch 0.4 mm 0.8 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 5.5 mm
Base Number Matches 1 2
Manufacturer Package Code SOT-536-1

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