74LVCH821ADB-T
vs
74LVC821ADB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Package Description
SSOP,
SSOP, SSOP24,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
Length
8.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Number of Bits
10
Number of Functions
1
10
Number of Ports
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)
7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
Base Number Matches
1
2
Rohs Code
Max Frequency@Nom-Sup
150000000 Hz
Max I(ol)
0.024 A
Package Equivalence Code
SSOP24,.3
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
9.5 ns
Trigger Type
POSITIVE EDGE
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