74LVCH32374AEC,551 vs 74LVCH32374AEC,557 feature comparison

74LVCH32374AEC,551 NXP Semiconductors

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74LVCH32374AEC,557 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description PLASTIC, FBGA-96 PLASTIC, FBGA-96
Pin Count 96 96
Manufacturer Package Code SOT536-1 SOT536-1
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0 e0
Length 13.5 mm 13.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max Frequency@Nom-Sup 120000000 Hz 120000000 Hz
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 4 4
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TRAY TRAY
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 7 ns 7 ns
Propagation Delay (tpd) 6.4 ns 6.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
Base Number Matches 1 1

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