74LVCH322244AEC-S
vs
74LVCH322244AEC;55
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
BGA
BGA
Package Description
LFBGA,
LFBGA, BGA96,6X16,32
Pin Count
96
96
Manufacturer Package Code
SOT-536-1
SOT536-1
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
Length
13.5 mm
13.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
4
4
Number of Functions
8
8
Number of Ports
2
2
Number of Terminals
96
96
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
6.7 ns
6.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
5.5 mm
5.5 mm
Base Number Matches
1
1
Rohs Code
Control Type
ENABLE LOW
JESD-609 Code
e0
Max I(ol)
0.012 A
Package Equivalence Code
BGA96,6X16,32
Prop. Delay@Nom-Sup
6.3 ns
Terminal Finish
TIN LEAD
Compare 74LVCH322244AEC-S with alternatives
Compare 74LVCH322244AEC;55 with alternatives