74LVCH16245ABX,518 vs 5962-9225801MXX feature comparison

74LVCH16245ABX,518 NXP Semiconductors

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5962-9225801MXX Integrated Device Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN DFP
Package Description HVBCC, SLGA60,8X12,20 CERPACK-48
Pin Count QFN 48
Manufacturer Package Code SOT1134-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Family LVC/LCX/Z FCT
JESD-30 Code R-PBCC-B60 R-GDFP-F48
JESD-609 Code e3 e0
Length 6 mm 15.875 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.024 A
Moisture Sensitivity Level 2
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 60 48
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code HVBCC DFP
Package Equivalence Code SLGA60,8X12,20 FL48,.4,25
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLATPACK
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 6 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 2.413 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 1.2 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form BUTT FLAT
Terminal Pitch 0.5 mm 0.635 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm 9.652 mm
Base Number Matches 2 2
Additional Feature WITH DIRECTION CONTROL
Screening Level MIL-STD-883

Compare 74LVCH16245ABX,518 with alternatives

Compare 5962-9225801MXX with alternatives