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74LVCH16244AEV,518 vs 74LVCH16244AEV,157 feature comparison

74LVCH16244AEV,518 NXP Semiconductors

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74LVCH16244AEV,157 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description 4.50 X 7 X 0.65 MM, PLASTIC, MO-225, SOT-702-1, VFBGA-56 VFBGA, BGA56,6X10,25
Pin Count 56 56
Manufacturer Package Code SOT702-1 SOT702-1
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e0
Length 7 mm 7 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 2 2
Number of Bits 4 4
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA56,6X10,25 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 6 ns 6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.97 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 4.5 mm 4.5 mm
Base Number Matches 2 2
Control Type ENABLE LOW
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Packing Method TR
Prop. Delay@Nom-Sup 5.5 ns
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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