74LVCH16244ABQ
vs
74VCXH162244T
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Part Package Code
QFN
TSSOP
Package Description
HVBCC,
TSSOP, TSSOP48,.3,20
Pin Count
60
48
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
ALVC/VCX/A
JESD-30 Code
R-PBCC-B60
R-PDSO-G48
JESD-609 Code
e4
e0
Length
6 mm
12.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
2
Number of Bits
4
4
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
60
48
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVBCC
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
6 ns
4.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
2.3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
BUTT
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4 mm
6.1 mm
Base Number Matches
5
2
Control Type
ENABLE LOW
Load Capacitance (CL)
30 pF
Max I(ol)
0.012 A
Package Equivalence Code
TSSOP48,.3,20
Prop. Delay@Nom-Sup
3.4 ns
Compare 74LVCH16244ABQ with alternatives
Compare 74VCXH162244T with alternatives