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74LVC841PW-T vs 74LVC841APW,112 feature comparison

74LVC841PW-T NXP Semiconductors

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74LVC841APW,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSSOP, 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G24 R-PDSO-G24
Length 7.8 mm 7.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 8 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code TSSOP2
Pin Count 24
Manufacturer Package Code SOT355-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP24,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 8.5 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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Compare 74LVC841APW,112 with alternatives