74LVC827AD,118
vs
SN74LVC827DW
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOP
|
|
| Pin Count |
24
|
|
| Manufacturer Package Code |
SOT137-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
WITH DUAL OUTPUT ENABLE
|
WITH DUAL OUTPUT ENABLE
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e4
|
e0
|
| Length |
15.4 mm
|
15.4 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
7.1 ns
|
7 ns
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
|
|
|
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