74LVC623APW,118
vs
74LVCH623APW
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
TSSOP
Package Description
TSSOP,
Pin Count
20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
Length
6.5 mm
6.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS TRANSCEIVER
BUS TRANSCEIVER
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
7.5 ns
6.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
4.4 mm
Base Number Matches
1
3
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