74LVC541APWDH-T vs IDT74LVC541APG feature comparison

74LVC541APWDH-T NXP Semiconductors

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IDT74LVC541APG Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP, TSSOP20,.25
Pin Count 20 20
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.3 12.3
Average Weight (mg) 78.775 78.775
CO2e (mg) 968.933 968.933
Category CO2 Kg 12.3 12.3
Compliance Temperature Grade Industrial: -40C to +85C Industrial: -40C to +85C
Additional Feature WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 6.5 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 6.6 ns 5.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 1
Rohs Code No
Total Weight 64
CO2 787.2
Candidate List Date 2024-01-23
SVHC Over MCV 7439-92-1
CAS Accounted for Wt 93
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7439-92-1, 1333-86-4
Conflict Mineral Status DRC Conflict Free Undeterminable
Conflict Mineral Status Source FMD
Control Type ENABLE LOW
JESD-609 Code e0
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP20,.25
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 5.1 ns
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 20

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