Findchips: Compare 74LVC3GU04DP vs 74LVC3G14GM,125

74LVC3GU04DP vs 74LVC3G14GM,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	NEXPERIA	NXP SEMICONDUCTORS
Package Description	TSSOP,	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	S-PDSO-G8	S-PBCC-B8
JESD-609 Code	e4	e4
Length	3 mm	1.6 mm
Logic IC Type	INVERTER	INVERTER
Moisture Sensitivity Level	1	1
Number of Functions	3	3
Number of Inputs	1	1
Number of Terminals	8	8
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	VBCC
Package Shape	SQUARE	SQUARE
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	6.3 ns	12 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	0.5 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	NICKEL PALLADIUM GOLD SILVER	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	BUTT
Terminal Pitch	0.65 mm	0.5 mm
Terminal Position	DUAL	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	3 mm	1.6 mm
Base Number Matches	3	2
Part Package Code		QFN
Pin Count		8
Manufacturer Package Code		SOT902-2
Package Equivalence Code		LCC8,.06SQ,20
Packing Method		TR
Schmitt Trigger		YES
	Logic » Gates	Logic » Gates