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74LVC3GU04DC,125 vs 74HCT3G14DP feature comparison

74LVC3GU04DC,125 NXP Semiconductors

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74HCT3G14DP NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP SOIC
Package Description 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8 3 MM, PLASTIC, SOT-505-2, TSSOP-8
Pin Count 8 8
Manufacturer Package Code SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z HCT
JESD-30 Code R-PDSO-G8 S-PDSO-G8
JESD-609 Code e4 e4
Length 2.3 mm 3 mm
Logic IC Type INVERTER INVERTER
Max I(ol) 0.024 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSSOP
Package Equivalence Code TSSOP8,.12,20 TSSOP8,.16
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 6.3 ns 48 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 4.5 V
Supply Voltage-Nom (Vsup) 1.8 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 3 mm
Base Number Matches 1 5
Pbfree Code Yes
Load Capacitance (CL) 50 pF
Prop. Delay@Nom-Sup 48 ns
Logic » Gates
Logic » Gates

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