74LVC3G07GM,125 vs 74HCT3G07DC,125 feature comparison

74LVC3G07GM,125 Nexperia

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74HCT3G07DC,125 Nexperia

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NEXPERIA NEXPERIA
Part Package Code QFN SSOP
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8 VSSOP,
Pin Count 8 8
Manufacturer Package Code SOT902-2 SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 8 Weeks
Samacsys Manufacturer Nexperia Nexperia
Family LVC/LCX/Z HCT
JESD-30 Code S-PBCC-B8 R-PDSO-G8
JESD-609 Code e4 e4
Length 1.6 mm 2.3 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VBCC VSSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 8.4 ns 32 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form BUTT GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 2 mm
Base Number Matches 2 2
Package Equivalence Code TSSOP8,.12,20
Packing Method TR, 7 INCH

Compare 74LVC3G07GM,125 with alternatives

Compare 74HCT3G07DC,125 with alternatives