74LVC3G07GM,125 vs 74V2G70CTR feature comparison

74LVC3G07GM,125 Nexperia

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74V2G70CTR STMicroelectronics

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEXPERIA STMICROELECTRONICS
Part Package Code QFN SC-70
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8 SOT-323, 8 PIN
Pin Count 8 8
Manufacturer Package Code SOT902-2 SOT323
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer Nexperia
Family LVC/LCX/Z 74V
JESD-30 Code S-PBCC-B8 R-PDSO-G8
JESD-609 Code e4
Length 1.6 mm 2 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VBCC TSSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 8.4 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form BUTT GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.6 mm 1.25 mm
Base Number Matches 1 1
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code TSSOP8,.09,20
Packing Method TR
Prop. Delay@Nom-Sup 10.5 ns
Schmitt Trigger NO

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