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74LVC3G06DP,125 vs 74HCT3G07DC,125 feature comparison

74LVC3G06DP,125 NXP Semiconductors

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74HCT3G07DC,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP SSOP
Package Description 3 MM, PLASTIC, SOT505-2, TSSOP-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Pin Count 8 8
Manufacturer Package Code SOT505-2 SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z HCT
JESD-30 Code S-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e4
Length 3 mm 2.3 mm
Logic IC Type INVERTER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSSOP
Package Equivalence Code TSSOP8,.16 TSSOP8,.12,20
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 8.2 ns 32 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3 mm 2 mm
Base Number Matches 2 2
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Prop. Delay@Nom-Sup 32 ns
Logic » Gates
Logic » Gates

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