74LVC3G06DC
vs
NC7NZ04K8X
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
|
VSSOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e3
|
Length |
2.3 mm
|
2.3 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
INVERTER
|
INVERTER
|
Max I(ol) |
0.024 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
3
|
3
|
Number of Inputs |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
VSSOP
|
Package Equivalence Code |
TSSOP8,.12,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Prop. Delay@Nom-Sup |
4.3 ns
|
|
Propagation Delay (tpd) |
8.2 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2 mm
|
2 mm
|
Base Number Matches |
3
|
3
|
|
|
|
Compare 74LVC3G06DC with alternatives