74LVC377PWDH vs 74LVC377DB,118 feature comparison

74LVC377PWDH NXP Semiconductors

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74LVC377DB,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSOP SSOP2
Package Description TSSOP, 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE WITH HOLD MODE
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 7.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 11.2 ns 7.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 5.3 mm
fmax-Min 230 MHz 150 MHz
Base Number Matches 1 2
Rohs Code Yes
Manufacturer Package Code SOT339-1
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 125000000 Hz
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code SSOP20,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74LVC377DB,118 with alternatives