74LVC374PW-T vs 74LVC374APW,118 feature comparison

74LVC374PW-T NXP Semiconductors

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74LVC374APW,118 Nexperia

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Package Description TSSOP, SOP-20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 6.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 8.5 ns 10 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code TSSOP2
Pin Count 20
Manufacturer Package Code SOT360-1
Factory Lead Time 8 Weeks
Date Of Intro 1996-02-01
Samacsys Manufacturer Nexperia
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR, 13 INCH
Peak Reflow Temperature (Cel) 260
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74LVC374APW,118 with alternatives