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74LVC374ADB,118 vs MC74LCX374SD feature comparison

74LVC374ADB,118 NXP Semiconductors

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MC74LCX374SD Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SSOP2
Pin Count 20
Manufacturer Package Code SOT339-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e0
Length 7.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER D FLIP-FLOP
Max Frequency@Nom-Sup 120000000 Hz 150000000 Hz
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 8
Number of Functions 1 8
Number of Ports 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP20,.3 SSOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9 ns 8.5 ns
Propagation Delay (tpd) 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm
Base Number Matches 2 4
Package Description SSOP, SSOP20,.3
Power Supplies 3.3 V
Logic » Bus Driver/Transceivers
Logic » FF/Latches

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