74LVC373APW-Q100J
vs
74LVCH162373ADG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Part Package Code
TSSOP2
TSSOP
Package Description
TSSOP,
6.10 MM, PLASTIC, MO-153ED, SOT-362-1, TSSOP-48
Pin Count
20
48
Manufacturer Package Code
SOT360-1
Reach Compliance Code
compliant
unknown
Factory Lead Time
8 Weeks
Samacsys Manufacturer
Nexperia
Control Type
ENABLE LOW
Count Direction
UNIDIRECTIONAL
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G20
R-PDSO-G48
JESD-609 Code
e4
e0
Length
6.5 mm
12.5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Bits
8
Number of Functions
1
2
Number of Ports
2
2
Number of Terminals
20
48
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR, 13 INCH
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
9 ns
Propagation Delay (tpd)
19.3 ns
6.8 ns
Screening Level
AEC-Q100
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD SILVER
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
6.1 mm
Base Number Matches
1
8
Rohs Code
HTS Code
8542.39.00.01
Qualification Status
Not Qualified
Compare 74LVC373APW-Q100J with alternatives
Compare 74LVCH162373ADG with alternatives