74LVC32APG vs 74LVC32APW-Q100J feature comparison

74LVC32APG Integrated Device Technology Inc

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74LVC32APW-Q100J NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP14,.25 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Pin Count 14 14
Manufacturer Package Code PG14 SOT402-1
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP14,.25 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 3.8 ns 5 ns
Propagation Delay (tpd) 3.8 ns 10.4 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 2
Length 5 mm
Packing Method TR
Screening Level AEC-Q100
Seated Height-Max 1.1 mm
Width 4.4 mm

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