Findchips: Compare 74LVC32ADB,118 vs 74LVC32ADB-T

74LVC32ADB,118 vs 74LVC32ADB-T feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	SSOP1
Pin Count	14
Manufacturer Package Code	SOT337-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	4 Weeks
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e4	e4
Length	6.2 mm	6.2 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	OR GATE	OR GATE
Max I(ol)	0.024 A
Moisture Sensitivity Level	1	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SSOP	SSOP
Package Equivalence Code	SSOP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Packing Method	TR
Peak Reflow Temperature (Cel)	260	NOT SPECIFIED
Prop. Delay@Nom-Sup	5 ns
Propagation Delay (tpd)	5.5 ns	5.5 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	2 mm	2 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	1.2 V	1.2 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	NOT SPECIFIED
Width	5.3 mm	5.3 mm
Base Number Matches	1	2
Package Description		SSOP,
	Logic » Gates	Logic » Gates