74LVC32AD,112 vs 74LVC32AD-Q100 feature comparison

74LVC32AD,112 NXP Semiconductors

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74LVC32AD-Q100 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 5 ns
Propagation Delay (tpd) 5.5 ns 10.4 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 2 2
Screening Level AEC-Q100

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