74LVC2GU04GW,125 vs 74LVC2GU04DCKRE4 feature comparison

74LVC2GU04GW,125 NXP Semiconductors

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74LVC2GU04DCKRE4 Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code TSSOP SOIC
Package Description PLASTIC, SOT-363, SC-88, 6 PIN TSSOP,
Pin Count 6 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e4
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER INVERTER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 4.5 ns
Propagation Delay (tpd) 6.3 ns 5.5 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Pbfree Code Yes

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