74LVC2GU04DCKRE4
vs
74LVC2GU04GW,125
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
TSSOP
Package Description
TSSOP,
PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count
6
6
Reach Compliance Code
unknown
compliant
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e4
e3
Length
2 mm
2 mm
Logic IC Type
INVERTER
INVERTER
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
5.5 ns
6.3 ns
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
1.25 mm
1.25 mm
Base Number Matches
2
2
Manufacturer Package Code
SOT363
HTS Code
8542.39.00.01
Package Equivalence Code
TSSOP6,.08
Packing Method
TR
Qualification Status
Not Qualified
Schmitt Trigger
NO
Compare 74LVC2GU04GW,125 with alternatives