74LVC2G74GM
vs
SN74LVC2G74YZAR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
QFN
DSBGA
Package Description
HVQCCN, LCC8,.06SQ,20
MO-211EB, GREEN, DSBGA-8
Pin Count
8
8
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
S-PQCC-N8
R-XBGA-B8
JESD-609 Code
e4
e1
Length
1.6 mm
1.9 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVQCCN
VFBGA
Package Equivalence Code
LCC8,.06SQ,20
BGA8,2X4,20
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
13.4 ns
14.4 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN SILVER COPPER
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
1.6 mm
0.9 mm
fmax-Min
200 MHz
200 MHz
Base Number Matches
2
1
Max Frequency@Nom-Sup
175000000 Hz
Max I(ol)
0.032 A
Output Characteristics
3-STATE
Prop. Delay@Nom-Sup
5.9 ns
Compare 74LVC2G74GM with alternatives
Compare SN74LVC2G74YZAR with alternatives