74LVC2G66DP-Q100H
vs
74LVC2G66DC-G
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP-8
|
TSSOP, TSSOP8,.12,20
|
Pin Count |
8
|
|
Manufacturer Package Code |
SOT505-2
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Nexperia
|
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
|
Length |
3 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Channels |
1
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Off-state Isolation-Nom |
37 dB
|
|
On-state Resistance-Max (Ron) |
195 Ω
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.1 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
1.65 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
11.5 ns
|
|
Switch-on Time-Max |
13 ns
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Package Equivalence Code |
|
TSSOP8,.12,20
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare 74LVC2G66DP-Q100H with alternatives
Compare 74LVC2G66DC-G with alternatives