74LVC2G66DP-Q100
vs
SN74LVC2G66DCURE4
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
SPST
|
SPST
|
Moisture Sensitivity Level |
1
|
1
|
Screening Level |
AEC-Q100
|
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Package Description |
|
VSSOP,
|
Pin Count |
|
8
|
JESD-30 Code |
|
R-PDSO-G8
|
JESD-609 Code |
|
e4
|
Length |
|
2.3 mm
|
Number of Channels |
|
1
|
Number of Functions |
|
2
|
Number of Terminals |
|
8
|
Off-state Isolation-Nom |
|
42 dB
|
On-state Resistance Match-Nom |
|
5 Ω
|
On-state Resistance-Max (Ron) |
|
20 Ω
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
VSSOP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
|
2.3 V
|
Surface Mount |
|
YES
|
Switch-off Time-Max |
|
6.9 ns
|
Switch-on Time-Max |
|
5.6 ns
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
2 mm
|
|
|
|
Compare SN74LVC2G66DCURE4 with alternatives