74LVC2G66DP-Q100
vs
74LVC2G66DC-G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| Moisture Sensitivity Level |
1
|
|
| Screening Level |
AEC-Q100
|
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Package Description |
|
TSSOP, TSSOP8,.12,20
|
| JESD-30 Code |
|
R-PDSO-G8
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.12,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
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