74LVC2G66DC-Q100H
vs
SN74LVC2G66DCURE4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
SSOP
SOIC
Pin Count
8
8
Manufacturer Package Code
SOT765-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Normal Position
NO
Number of Functions
2
2
Number of Terminals
8
8
On-state Resistance-Max (Ron)
195 Ω
20 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VSSOP
Package Equivalence Code
TSSOP8,.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Screening Level
AEC-Q100
Supply Voltage-Nom (Vsup)
3.3 V
2.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Pbfree Code
Package Description
VSSOP,
JESD-609 Code
e4
Length
2.3 mm
Moisture Sensitivity Level
1
Number of Channels
1
Off-state Isolation-Nom
42 dB
On-state Resistance Match-Nom
5 Ω
Peak Reflow Temperature (Cel)
260
Seated Height-Max
0.9 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Switch-off Time-Max
6.9 ns
Switch-on Time-Max
5.6 ns
Terminal Finish
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
2 mm
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