74LVC2G66DC-G
vs
NC7WB66K8X
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
TSSOP, TSSOP8,.12,20
|
3.10 MM, MO-187, US-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VSSOP
|
| Package Equivalence Code |
TSSOP8,.12,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
8
|
| JESD-609 Code |
|
e3
|
| Length |
|
2.3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
1
|
| Off-state Isolation-Nom |
|
55 dB
|
| On-state Resistance Match-Nom |
|
0.5 Ω
|
| On-state Resistance-Max (Ron) |
|
20 Ω
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.65 V
|
| Switch-off Time-Max |
|
6.9 ns
|
| Switch-on Time-Max |
|
5.6 ns
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
2 mm
|
|
|
|
Compare 74LVC2G66DC-G with alternatives
Compare NC7WB66K8X with alternatives