74LVC2G53DP-G
vs
HD74LVC2G53CPE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
BGA
Package Description
TSSOP, TSSOP8,.16
VFBGA,
Pin Count
8
8
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
S-PDSO-G8
R-XBGA-B8
JESD-609 Code
e4
Length
3 mm
1.9 mm
Moisture Sensitivity Level
1
Number of Channels
2
2
Number of Functions
1
1
Number of Terminals
8
8
Off-state Isolation-Nom
40 dB
50 dB
On-state Resistance-Max (Ron)
35 Ω
20 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
VFBGA
Package Equivalence Code
TSSOP8,.16
BGA8,2X4,20
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
0.5 mm
Supply Current-Max (Isup)
0.04 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
2.3 V
Surface Mount
YES
YES
Switch-off Time-Max
7.8 ns
7.9 ns
Switch-on Time-Max
7 ns
7.2 ns
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Width
3 mm
0.9 mm
Base Number Matches
1
1
On-state Resistance Match-Nom
5 Ω
Compare 74LVC2G53DP-G with alternatives
Compare HD74LVC2G53CPE with alternatives