74LVC2G34GW-Q100 vs SN74LVC2G07YZPR feature comparison

74LVC2G34GW-Q100 NXP Semiconductors

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SN74LVC2G07YZPR Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SOT-363 BGA
Package Description TSSOP, GREEN, DSBGA-6
Pin Count 6 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-XBGA-B6
JESD-609 Code e3 e1
Length 2 mm 1.4 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 10.8 ns 8.6 ns
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 1.25 mm 0.9 mm
Base Number Matches 2 1
Pbfree Code Yes
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Load Capacitance (CL) 50 pF
Max I(ol) 0.032 A
Output Characteristics OPEN-DRAIN
Package Equivalence Code BGA6,2X3,20
Packing Method TR
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 3.7 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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