Findchips: Compare 74LVC2G34GW-Q100,1 vs 74LVC2G34GW

74LVC2G34GW-Q100,1 vs 74LVC2G34GW feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Active
Ihs Manufacturer	NEXPERIA	NEXPERIA
Part Package Code	TSSOP
Package Description	TSSOP,
Pin Count	6
Manufacturer Package Code	SOT363-2
Reach Compliance Code	compliant	compliant
Samacsys Manufacturer	Nexperia	Nexperia
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
JESD-609 Code	e3	e3
Length	2 mm	2 mm
Logic IC Type	BUFFER	BUFFER
Moisture Sensitivity Level	1	1
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR, 7 INCH
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	10.8 ns	10.8 ns
Screening Level	AEC-Q100
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1.25 mm	1.25 mm
Base Number Matches	1	7
Rohs Code		Yes
ECCN Code		EAR99
HTS Code		8542.39.00.01
Qualification Status		Not Qualified
	Logic » Gates	Logic » Gates