74LVC2G34GV
vs
74LVC2G34GW-Q100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NEXPERIA
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
e3
Load Capacitance (CL)
50 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP
TSSOP
Package Equivalence Code
TSOP6,.11,37
TSSOP6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
5.1 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
YES
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Package Description
TSSOP,
Family
LVC/LCX/Z
Length
2 mm
Number of Functions
2
Number of Inputs
1
Power Supply Current-Max (ICC)
0.004 mA
Propagation Delay (tpd)
10.8 ns
Screening Level
AEC-Q100
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Time@Peak Reflow Temperature-Max (s)
30
Width
1.25 mm
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