74LVC2G34GV vs 74LVC2G34GW feature comparison

74LVC2G34GV Philips Semiconductors

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74LVC2G34GW Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS NEXPERIA
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP TSSOP
Package Equivalence Code TSOP6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 5.1 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
ECCN Code EAR99
Family LVC/LCX/Z
Length 2 mm
Number of Functions 2
Number of Inputs 1
Propagation Delay (tpd) 10.8 ns
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm

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