74LVC2G241GT,115 vs 74LVC2G241GM,125 feature comparison

74LVC2G241GT,115 NXP Semiconductors

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74LVC2G241GM,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON QFN
Package Description 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-833-1, SON-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT-902-1, XQFN-8
Pin Count 8 8
Manufacturer Package Code SOT833-1 SOT902-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION
Control Type ENABLE LOW/HIGH ENABLE LOW/HIGH
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-N8 S-PQCC-N8
JESD-609 Code e3 e4
Length 1.95 mm 1.6 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VQCCN
Package Equivalence Code SOLCC8,.04,20 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 11 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.55 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.6 mm
Base Number Matches 2 2

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