74LVC2G17GV vs TC7PZ07FU feature comparison

74LVC2G17GV Philips Semiconductors

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TC7PZ07FU Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS TOSHIBA CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A 0.032 A
Moisture Sensitivity Level 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP TSSOP
Package Equivalence Code TSOP6,.11,37 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 7.1 ns 10.5 ns
Qualification Status Not Qualified
Schmitt Trigger YES NO
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Package Description TSSOP,
Family LVC/LCX/Z
Length 2 mm
Number of Functions 2
Number of Inputs 1
Output Characteristics OPEN-DRAIN
Power Supply Current-Max (ICC) 100 mA
Propagation Delay (tpd) 10.5 ns
Screening Level AEC-Q100
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm

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