74LVC2G17GV vs 74LVC2G17GV,125 feature comparison

74LVC2G17GV Nexperia

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74LVC2G17GV,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSOP-6 PLASTIC, SC-74, SOT-457, 6 PIN
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-18
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2.9 mm 2.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.032 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP TSSOP
Package Equivalence Code TSOP6,.11,37 TSOP6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.004 mA
Propagation Delay (tpd) 13.1 ns 13.1 ns
Schmitt Trigger YES YES
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.5 mm 1.5 mm
Base Number Matches 4 1
Part Package Code TSOP
Pin Count 6
Manufacturer Package Code SOT457
Samacsys Manufacturer NXP
Packing Method TR
Prop. Delay@Nom-Sup 7.1 ns
Qualification Status Not Qualified

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Compare 74LVC2G17GV,125 with alternatives