74LVC2G17GV,125
vs
SN74LVC2G07YZPR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSOP
|
BGA
|
| Package Description |
TSOP-6
|
GREEN, DSBGA-6
|
| Pin Count |
6
|
6
|
| Manufacturer Package Code |
SOT457
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
2017-02-18
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G6
|
R-XBGA-B6
|
| JESD-609 Code |
e3
|
e1
|
| Length |
2.9 mm
|
1.4 mm
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSOP
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
13.1 ns
|
8.6 ns
|
| Seated Height-Max |
1.1 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.95 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
1.5 mm
|
0.9 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Output Characteristics |
|
OPEN-DRAIN
|
|
|
|
Compare 74LVC2G17GV,125 with alternatives