74LVC2G17DW-7 vs 74LVC2G07GV feature comparison

74LVC2G17DW-7 Diodes Incorporated

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74LVC2G07GV NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer DIODES INC NXP SEMICONDUCTORS
Part Package Code SOT-363 TSOP
Package Description TSSOP, TSSOP6,.08 PLASTIC, SC-74, SOT-457, TSOP-6
Pin Count 6 6
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks
Samacsys Manufacturer Diodes Incorporated
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2 mm 2.9 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSOP6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 13.1 ns 8.4 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.5 mm
Base Number Matches 1 3
Output Characteristics OPEN-COLLECTOR

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Compare 74LVC2G07GV with alternatives