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74LVC2G14GW,125 vs 74AUP1G14GF,132 feature comparison

74LVC2G14GW,125 NXP Semiconductors

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74AUP1G14GF,132 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP SON
Package Description PLASTIC, SOT-363, SC-88, 6 PIN 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Pin Count 6 6
Manufacturer Package Code SOT363 SOT891
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family LVC/LCX/Z AUP/ULP/V
JESD-30 Code R-PDSO-G6 S-PDSO-N6
JESD-609 Code e3 e3
Length 2 mm 1 mm
Logic IC Type INVERTER INVERTER
Max I(ol) 0.024 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 2 1
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP6,.08 SOLCC6,.04,14
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 12 ns 20 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 0.8 V
Supply Voltage-Nom (Vsup) 1.8 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1 mm
Base Number Matches 2 2
Factory Lead Time 4 Weeks
Load Capacitance (CL) 30 pF
Prop. Delay@Nom-Sup 20 ns
Logic » Gates
Logic » Gates

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