Findchips: Compare 74LVC2G07GW vs 74LVC2G07GW,125

74LVC2G07GW vs 74LVC2G07GW,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	PHILIPS SEMICONDUCTORS	NXP SEMICONDUCTORS
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
JESD-609 Code	e3	e3
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	BUFFER	BUFFER
Max I(ol)	0.024 A	0.024 A
Moisture Sensitivity Level	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Equivalence Code	TSSOP6,.08	TSSOP6,.08
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR	TR
Peak Reflow Temperature (Cel)	260	260
Prop. Delay@Nom-Sup	4.7 ns	4.7 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Supply Voltage-Nom (Vsup)	3.3 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	MATTE TIN	Tin (Sn)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.635 mm	0.65 mm
Terminal Position	DUAL	DUAL
Base Number Matches	3	2
Part Package Code		TSSOP
Package Description		PLASTIC, SC-88, SOT-363, 6 PIN
Pin Count		6
Manufacturer Package Code		SOT363
Family		LVC/LCX/Z
Length		2 mm
Number of Functions		2
Number of Inputs		1
Propagation Delay (tpd)		8.4 ns
Seated Height-Max		1.1 mm
Supply Voltage-Max (Vsup)		5.5 V
Supply Voltage-Min (Vsup)		1.65 V
Time@Peak Reflow Temperature-Max (s)		30
Width		1.25 mm
	Logic » Gates	Logic » Gates