74LVC2G07GW,132
vs
SN74LVC2G07MDCKTEP
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NEXPERIA
TEXAS INSTRUMENTS INC
Package Description
TSSOP,
TSSOP, TSSOP6,.08
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
e4
Length
2 mm
2 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
8.4 ns
5.7 ns
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
TIN
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.25 mm
1.25 mm
Base Number Matches
1
1
Pbfree Code
Yes
Part Package Code
SOIC
Pin Count
6
Samacsys Manufacturer
Texas Instruments
Load Capacitance (CL)
50 pF
Max I(ol)
0.032 A
Package Equivalence Code
TSSOP6,.08
Packing Method
TR
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
5.7 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
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