74LVC2G07GV
vs
SN74LVC2G34DBV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
TSOP
Package Description
PLASTIC, SC-74, SOT-457, TSOP-6
LSSOP, TSOP6,.11,37
Pin Count
6
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
Length
2.9 mm
2.9 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-COLLECTOR
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LSSOP
Package Equivalence Code
TSOP6,.11,37
TSOP6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
8.4 ns
9.6 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
1.45 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.95 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.5 mm
1.6 mm
Base Number Matches
3
1
Max I(ol)
0.032 A
Power Supply Current-Max (ICC)
0.01 mA
Compare 74LVC2G07GV with alternatives
Compare SN74LVC2G34DBV with alternatives