74LVC2G04GV-R
vs
74LVC2G06GW-Q100H
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SC-74
TSSOP
Package Description
TSSOP,
PLASTIC, SC-88, SOT-363, 6 PIN
Pin Count
6
6
Manufacturer Package Code
SOT457
SOT363
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
e3
Length
2.9 mm
2 mm
Logic IC Type
INVERTER
INVERTER
Number of Functions
2
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
9.5 ns
8.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.5 mm
1.25 mm
Base Number Matches
1
2
Rohs Code
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Output Characteristics
OPEN-DRAIN
Package Equivalence Code
TSSOP6,.08
Packing Method
TR
Schmitt Trigger
NO
Screening Level
AEC-Q100
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