74LVC27BQ vs 74LVC27BQ,115 feature comparison

74LVC27BQ Philips Semiconductors

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74LVC27BQ,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description QCCN, LCC14,.1X.12,20 HVQCCN, LCC14,.1X.12,20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PQCC-N14 R-PQCC-N14
JESD-609 Code e4 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.024 A 0.024 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCN HVQCCN
Package Equivalence Code LCC14,.1X.12,20 LCC14,.1X.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Prop. Delay@Nom-Sup 5.9 ns 6.8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code QFN
Pin Count 14
Family LVC/LCX/Z
Length 3 mm
Moisture Sensitivity Level 1
Number of Functions 3
Number of Inputs 3
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 7 ns
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 2.5 mm

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