74LVC273PW,112
vs
RD74LVC273BTELL
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
TSSOP2
|
TSSOP
|
| Package Description |
TSSOP-20
|
TSSOP, TSSOP20,.25
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
SOT360-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
|
|
| Date Of Intro |
1995-11-01
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
|
| Length |
6.5 mm
|
6.5 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
22.2 ns
|
21.6 ns
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
4.4 mm
|
4.4 mm
|
| fmax-Min |
150 MHz
|
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Load Capacitance (CL) |
|
50 pF
|
| Max Frequency@Nom-Sup |
|
150000000 Hz
|
| Max I(ol) |
|
0.024 A
|
| Package Equivalence Code |
|
TSSOP20,.25
|
| Packing Method |
|
TR
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 74LVC273PW,112 with alternatives
Compare RD74LVC273BTELL with alternatives