74LVC257PW-T
vs
MC74LCX258DG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ON SEMICONDUCTOR
Package Description
TSSOP,
SOP, SOP16,.25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Propagation Delay (tpd)
8 ns
8.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
3.9 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
SOIC
Pin Count
16
JESD-609 Code
e3
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP16,.25
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
6.5 ns
Terminal Finish
TIN
Compare 74LVC257PW-T with alternatives
Compare MC74LCX258DG with alternatives